We are pleased to announce that our company has been adopted by Aichi Prefecture for “Aichi Priority Project II”.<\/p>\n
Research theme: Development of high thermal conductive materials for device mounting and grinding wheels for device materials
\nSubsidy amount:90 million yen ( approx.$672,000)<\/p>\n
Click HERE<\/a> for the outline >>
\nClick HERE<\/a> for the development results>>
\nSource: Industry-University Cooperative Research Web pamphlet<\/p>\n","protected":false},"featured_media":912,"template":"","news_category":[10],"class_list":["post-1133","news","type-news","status-publish","has-post-thumbnail","hentry","news_category-finance"],"acf":[],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/news\/1133","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/news"}],"about":[{"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/types\/news"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/media\/912"}],"wp:attachment":[{"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/media?parent=1133"}],"wp:term":[{"taxonomy":"news_category","embeddable":true,"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/news_category?post=1133"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}