{"id":1156,"date":"2023-06-15T15:38:42","date_gmt":"2023-06-15T06:38:42","guid":{"rendered":"https:\/\/umap-corp.com\/en\/?post_type=news&p=1156"},"modified":"2023-06-20T16:00:26","modified_gmt":"2023-06-20T07:00:26","slug":"u-map-ceo-nishitani-to-speak-at-the-6th-ceramic-substrate-and-packaging-industry-summit-forum-in-china","status":"publish","type":"news","link":"https:\/\/umap-corp.com\/en\/news\/u-map-ceo-nishitani-to-speak-at-the-6th-ceramic-substrate-and-packaging-industry-summit-forum-in-china\/","title":{"rendered":"U-MAP CEO Nishitani to speak at “The 6th Ceramic Substrate and Packaging Industry Summit Forum” in China!"},"content":{"rendered":"

U-MAP CEO Nishitani will give an online presentation <\/strong><\/span>at <\/strong><\/span><\/span><\/p>\n

“The 6th Ceramic Substrate and Packaging Industry Summit Forum” in China <\/strong><\/span>on June 30! <\/strong><\/span><\/span><\/p>\n

Don’t miss it! *There is a fee for this event and it will be held onsite.<\/span><\/p>\n

 <\/p>\n

Content: <\/span><\/p>\n

Lecture (Simultaneous Chinese interpretation): “High Strength AlN Substrates and Fibrous Aluminum Nitride Single Crystals (Thermalnite)<\/span><\/p>\n

Remarks: <\/span><\/p>\n

The development of aluminum nitride substrates and Thermalnite fibers has improved fracture toughness and thermal conductivity to an amazing level. In the presentation, the results will be introduced in detail.<\/span><\/p>\n

 <\/p>\n

Name: 6th Ceramic Substrate and Packaging Industry Summit Forum @ China<\/strong><\/span>
\nDuration: June 30, 2023<\/strong><\/span>
\nClick here<\/a> for detail\uff01\uff01<\/strong><\/span><\/p>\n","protected":false},"featured_media":1157,"template":"","news_category":[8],"class_list":["post-1156","news","type-news","status-publish","has-post-thumbnail","hentry","news_category-others"],"acf":[],"aioseo_notices":[],"aioseo_head":"\n\t\t\n\t\n\t\n\t\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t