{"id":1211,"date":"2023-12-20T13:21:48","date_gmt":"2023-12-20T04:21:48","guid":{"rendered":"https:\/\/umap-corp.com\/en\/?post_type=news&#038;p=1211"},"modified":"2023-12-20T13:33:00","modified_gmt":"2023-12-20T04:33:00","slug":"nepconjapan2024","status":"publish","type":"news","link":"https:\/\/umap-corp.com\/en\/news\/nepconjapan2024\/","title":{"rendered":"U-MAP will exhibit at &#8220;NEPCON JAPAN 2024&#8221; at Tokyo Big Sight!"},"content":{"rendered":"<p><span style=\"font-size: 14pt;\"><strong>U-MAP will exhibit jointly at the 1st Power Devices &amp; Modules EXPO at &#8220;NEPCON JAPAN 2024&#8221; to be held at Tokyo Big Sight from January 24th to 26th, 2024!<\/strong><\/span><\/p>\n<p><strong>Exhibit details (jointly with Okamoto Glass Co., Ltd.):<\/strong><br \/>\n<strong>\u3000Thin film TIM sheet with low thermal resistance<\/strong><br \/>\n<strong>\u3000High strength AlN substrate<\/strong><br \/>\n<strong>\u3000AlN whisker (Thermalnite\u00ae)<\/strong><br \/>\n<strong>\u3000AlN Whisker with improved water resistance<\/strong><\/p>\n<p><strong>Highlights:<\/strong><br \/>\n<strong>\u3000New product unveiled for the first time!<\/strong><br \/>\n<strong>\u3000We have successfully developed an insulating TIM sheet with low thermal resistance!<\/strong><br \/>\n<strong>\u3000Visit us at our booth for further advantages.<\/strong><\/p>\n<p>Exhibition Name: NEPCON JAPAN 2024 @ Tokyo Big Sight<br \/>\nPeriod: 2024\/1\/24-26<br \/>\n*Reservations to visit the exhibition are required!<span style=\"color: #ff0000;\"> (<a style=\"color: #ff0000;\" href=\"https:\/\/www.nepconjapan.jp\/tokyo\/ja-jp\/register.html?code=0907435368669349-2LK\">Reservation<\/a>)<\/span><\/p>\n<p>U-MAP Exhibit Booth: East Hall 6, E55-11<br \/>\nU-MAP <a href=\"http:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2023\/12\/U-MAP\u5c0f\u9593\u4f4d\u7f6e.pdf\">Booth Location<\/a><br \/>\nClick <a href=\"https:\/\/www.nepconjapan.jp\/tokyo\/en-gb\/search\/2024\/directory\/directory-details.%25E6%25A0%25AA%25E5%25BC%258F%25E4%25BC%259A%25E7%25A4%25BE%2BU-MAP.org-205a9352-0b9c-4128-aa55-a952c0d9ee52.html#\/\">here<\/a> for exhibitor page<\/p>\n<p>The Power Devices &amp; Modules Expo is a specialized exhibition where the latest technologies and products of the rapidly expanding power devices and modules market gather under one roof.<br \/>\nIt is a must-attend event for manufacturers of electronics, semiconductors, sensors, electronic components, power devices and modules, automobiles and electrical components<br \/>\nelectronics, semiconductors, sensors, electronic components, power devices\/modules, automobiles, and electrical components manufacturers from Japan and abroad!<br \/>\nClick<a href=\"https:\/\/www.nepconjapan.jp\/tokyo\/en-gb.html?co=ex\"> here<\/a> for exhibition details<\/p>\n<p>Don&#8217;t miss U-MAP&#8217;s latest &#8220;Heat Dissipation Sheet Solution&#8221;!<\/p>\n","protected":false},"featured_media":1213,"template":"","news_category":[8],"class_list":["post-1211","news","type-news","status-publish","has-post-thumbnail","hentry","news_category-others"],"acf":[],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/news\/1211","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/news"}],"about":[{"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/types\/news"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/media\/1213"}],"wp:attachment":[{"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/media?parent=1211"}],"wp:term":[{"taxonomy":"news_category","embeddable":true,"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/news_category?post=1211"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}