{"id":1272,"date":"2025-01-17T16:27:58","date_gmt":"2025-01-17T07:27:58","guid":{"rendered":"https:\/\/umap-corp.com\/en\/?post_type=news&p=1272"},"modified":"2025-01-22T06:51:22","modified_gmt":"2025-01-21T21:51:22","slug":"%e3%80%90press-release%e3%80%91new-high-thermal-conductivity-heat-dissipation-sheet","status":"publish","type":"news","link":"https:\/\/umap-corp.com\/en\/news\/%e3%80%90press-release%e3%80%91new-high-thermal-conductivity-heat-dissipation-sheet\/","title":{"rendered":"\u3010Press Release\u3011 Thermal Material Startup U-MAP Co., Ltd. Announces New Product: “High Thermal Conductivity Heat Dissipation Sheet”"},"content":{"rendered":"

January 17, 2025 \u2013<\/strong><\/span><\/p>\n

Introducing a Revolutionary New Product for Thermal Management!<\/span><\/h3>\n

Combining Industry-Leading Thermal Conductivity and Flexibility Through Optimal Filler Design!<\/strong><\/span><\/p>\n

U-MAP Co., Ltd. (Headquarters: Nagoya, Aichi, Japan), a thermal materials startup originating from Nagoya University, announces the launch of its new “Thermalnite\u00ae High Thermal Conductivity Heat Dissipation Sheet.”<\/strong> This groundbreaking product achieves an industry-leading thermal conductivity of 14 W\/(m\u00b7K)<\/strong> while maintaining exceptional flexibility, dramatically enhancing heat dissipation performance for power modules, CPUs, GPUs, and more.
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New Product<\/strong><\/span><\/h3>\n

Thermalnite\u00ae High Thermal Conductivity Heat Dissipation Sheet<\/strong><\/span><\/p>\n

Key Features<\/strong><\/span><\/h4>\n

\u25bb High Thermal Conductivity (14 W\/(m\u00b7K))<\/strong>: Maximizes heat dissipation across devices.<\/span>
\n\u25bb Flexibility<\/strong>: Ensures superior adhesion, absorbing dimensional tolerances between components.<\/span>
\n\u25bb Resilience<\/strong>: Maintains low thermal resistance under vibration or thermal deformation.<\/span>
\n\u25bb Low Thermal Resistance<\/strong>: Delivers outstanding performance even under low pressure, protecting components.<\/span><\/p>\n

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Applications<\/strong><\/span><\/h3>\n

Between Power Modules and Heat Sinks<\/strong><\/span>
\n\u25bb Exceptional thermal conductivity and resilience accommodate substrate warping caused by thermal deformation.<\/span>
\n\u25bb Maintains excellent thermal resistance, maximizing heat dissipation for high-output devices.<\/span><\/p>\n

Between CPUs, GPUs, and Heat Sinks<\/strong><\/span>
\n\u25bb Combines flexibility and thermal conductivity to cool multiple components effectively with a single sheet.<\/span>
\n\u25bb Reduces damage to components with its soft and adaptive material, suitable for a wide range of tolerances.<\/span>
\n\u25bb Absorbs dimensional variations in IC chips, enhancing system reliability.<\/span><\/p>\n

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Problem-Solving Capabilities<\/strong><\/span><\/h3>\n

Substrate Warping Due to Thermal Deformation:<\/strong> Maintains superior thermal resistance through high conductivity and resilience.
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Absorption of IC Tolerance:<\/strong> Soft material prevents damage and absorbs dimensional variations in components.
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Unveiling at NEPCON Japan 2025<\/strong><\/span><\/h3>\n

Be the first to see this product at NEPCON Japan 2025<\/strong>, held from January 22, 2025.<\/span>
\nVisit our booth for live demonstrations and to experience the product firsthand!<\/span><\/p>\n