{"id":1300,"date":"2025-07-15T09:42:24","date_gmt":"2025-07-15T00:42:24","guid":{"rendered":"https:\/\/umap-corp.com\/en\/?post_type=news&p=1300"},"modified":"2025-07-15T14:35:53","modified_gmt":"2025-07-15T05:35:53","slug":"pr-aln-substrate-mass-production-qualification","status":"publish","type":"news","link":"https:\/\/umap-corp.com\/en\/news\/pr-aln-substrate-mass-production-qualification\/","title":{"rendered":"\u3010Press Release\u3011U-MAP Achieves Mass Production Qualification for Aluminum Nitride (AlN) Heat-Dissipating Substrates"},"content":{"rendered":"

“U-MAP Establishing a Stable Supply System for High-Heat-Generating Devices<\/strong><\/span>“<\/span>
\n-July 15, 2026 \u2013<\/strong><\/p>\n

U-MAP Co., Ltd. (Head Office: Chikusa-ku, Nagoya, Aichi Prefecture; CEO: Kenji Nishitani) is pleased to announce that its proprietary aluminum nitride (AlN) heat-dissipating substrate has been officially qualified for mass production by a domestic substrate manufacturer. This milestone ensures a stable supply framework for applications such as laser diodes (LD), optical communication transceivers, LED lighting, and thermoelectric modules.<\/p>\n

\"\"<\/p>\n

\uff03Meeting the Demands of the Thermal Era<\/h2>\n

Since its founding, U-MAP has focused on addressing the root challenges of thermal management in electronic devices. We have now successfully built a system capable of mass-producing and stably supplying high-performance heat-dissipating materials.<\/p>\n

As electronic devices continue to evolve toward higher output and greater integration, thermal management has become a critical design factor. In particular, heat-generating components used in optoelectronics and power devices require highly reliable heat-dissipating substrates.<\/p>\n

Aluminum nitride (AlN) substrates, offering both excellent insulation and thermal conductivity around 170 W\/m\u00b7K, are widely adopted in high-reliability applications such as LD submounts, LED lighting, and thermoelectric modules. Laser diodes, which are increasingly used in data centers and telecommunications infrastructure, also benefit significantly from AlN\u2019s superior heat dissipation capabilities.
\n\"\"Left and right images: Examples of adoption for LD submount applications<\/em><\/p>\n

\uff03Fulfilling the Final Requirement for Market Adoption<\/h2>\n

In parallel with our materials R&D, U-MAP has also developed a production system and quality assurance framework aimed at the mass manufacturing of secondary products using these materials, such as AlN-based heat-dissipating substrates.<\/p>\n

The newly acquired mass production qualification recognizes that our product surpasses the prototype stage and is now a commercially viable solution. This was determined based on evaluations of production stability, defect rates, operational efficiency, standardized inspection protocols, and process-specific quality control. In other words, our product has been validated for its reliability, reproducibility, and continuity\u2014core factors for stable supply in the market.<\/p>\n

\uff03Earning Trust through Supply Stability<\/h2>\n

We believe that being chosen in the marketplace depends not only on technical innovation and product differentiation, but also on the ability to consistently deliver high-quality products over time.<\/p>\n

This mass production qualification marks a new phase in U-MAP\u2019s growth\u2014from a research-driven startup to a company capable of meeting real-world industrial demands with a fully developed production infrastructure.<\/p>\n

In addition to our 170 W\/m\u00b7K class products, we are actively developing even higher-performance substrates with thermal conductivities of 200 W\/m\u00b7K and 230 W\/m\u00b7K. These advancements are being pursued with a forward-looking approach, anticipating future market needs.<\/p>\n

Furthermore, evaluations and adoption discussions are already underway with overseas manufacturers, particularly in Taiwan.<\/p>\n

\uff03Product Information and Evaluation Samples<\/h2>\n

\u3000Product catalogs and evaluation samples are available upon request, tailored to your application or stage of consideration.
\nFor inquiries or consultations, please feel free to contact us via the information below.<\/p>\n

\n

\u300aCompany Overview\u300b<\/strong>
\nCompany Name: U-MAP Co.,Ltd.
\nAddress: TOIC 601, Nagoya University, Furo-cho, Chikusa-ku, Nagoya, Japan
\nRepresentative: Kenji Nishitani, CEO
\nEstablished: December 12, 2016
\nBusiness Activities: R&D, manufacturing, and sales of high thermal conductivity material \u201cThermalnite\u00ae\u201d
\nWebsite: https:\/\/umap-corp.com\/<\/a><\/p>\n

\u300aContact Information\u300b<\/strong>
\nBusiness Development Division \u2013 PR & Marketing Group
\nContact Person: Rie Yamada
\nEmail: pres.office@umap-corp.com
\nContact Form: https:\/\/umap-corp.com\/contact<\/a><\/p>\n

\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d\uff1d<\/p>\n

\u300aJoint Exhibition with Okamoto Glass at Two Trade Shows in July & August!\u300b<\/strong><\/p>\n

\u3010TECHNO-FRONTIER 2025 \u2013 Thermal Design and Management Expo\u3011<\/strong>
Dates:<\/strong> July 23 (Wed) \u2013 25 (Fri), 2025 | 10:00 AM \u2013 5:00 PM
Venue:<\/strong> Tokyo Big Sight
[Pre-registration Form]<\/p>\n

\u3010COMNEXT 2025 \u2013 Next Generation Communication Technology & Solutions Expo\u3011<\/strong>
Dates:<\/strong> July 30 (Wed) \u2013 August 1 (Fri), 2025 | 10:00 AM \u2013 5:00 PM
Venue:<\/strong> Tokyo Big Sight
[Pre-registration Form]<\/p>\n

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