{"id":1312,"date":"2025-07-30T14:08:55","date_gmt":"2025-07-30T05:08:55","guid":{"rendered":"https:\/\/umap-corp.com\/en\/?post_type=news&p=1312"},"modified":"2025-07-30T14:14:12","modified_gmt":"2025-07-30T05:14:12","slug":"techno-frontier2025comnext2025","status":"publish","type":"news","link":"https:\/\/umap-corp.com\/en\/news\/techno-frontier2025comnext2025\/","title":{"rendered":"U-MAP to Exhibit at TECHNO-FRONTIER 2025 and COMNEXT 2025!"},"content":{"rendered":"

Showcasing Thermal Solutions for Next-Generation Communications and Thermal Design<\/strong><\/span><\/p>\n

U-MAP is pleased to announce its consecutive participation in two leading industry exhibitions.
\nAt both events, we are presenting our advanced thermal management solutions utilizing our proprietary fibrous aluminum nitride filler, Thermalnite\u00ae, along with actual product displays.<\/p>\n

If you’re looking for next-generation thermal solutions to address the growing demands of high-output and miniaturized communication modules, we invite you to visit our booth.<\/p>\n

\ud83d\udd37 Exhibition #1<\/strong>
\nTECHNO-FRONTIER 2025 \u2013 Thermal Design & Management Expo<\/strong>
\n\ud83d\udcc5 Date: July 23 (Wed) \u2013 25 (Fri), 2025 | 10:00\u201317:00
\n\ud83d\udccd Venue: Tokyo Big Sight, West Hall 3
\n\ud83d\udd22 Booth: 3-BB20 (Co-exhibiting with Okamoto Glass)
\n\ud83e\udded Zone: Thermal Design & Management Technologies<\/p>\n

\ud83d\udd37 Exhibition #2<\/strong>
\nCOMNEXT 2025 \u2013 Next-Gen Communication Technology & Solutions Expo<\/strong>
\n\ud83d\udcc5 Date: July 30 (Wed) \u2013 August 1 (Fri), 2025 | 10:00\u201317:00
\n\ud83d\udccd Venue: Tokyo Big Sight, South Hall 1
\n\ud83d\udd22 Booth: C7-9 (Optical Communication World Zone)
\n\ud83d\udd17 Click here to pre-register for COMNEXT<\/a><\/p>\n

\ud83d\udd36 Key Products on Display (at both exhibitions)<\/strong>
\n\ud83d\udfe6 High-Strength, High-Thermal-Conductivity Ceramic Substrates (AlN)
\n\ud83d\udfe8 \u201cFiBCool\u201d Low Thermal Resistance & High Conformability Thermal Sheet
\n\ud83d\udfe5 Thermalnite\u00ae Hybrid Filler for Z-Axis Thermal Management<\/p>\n

As a thermal partner for the future of communications, U-MAP is committed to solving thermal challenges through product development, materials consultation, and collaborative R&D.<\/p>\n

We look forward to welcoming you at our booth and discussing how we can support your next innovation.<\/p>\n

\ud83d\udce9 For business meeting reservations or inquiries, please contact us here:
\nhttps:\/\/umap-corp.com\/contact<\/a><\/p>\n","protected":false},"featured_media":1313,"template":"","news_category":[8],"class_list":["post-1312","news","type-news","status-publish","has-post-thumbnail","hentry","news_category-others"],"acf":[],"aioseo_notices":[],"aioseo_head":"\n\t\t\n\t\n\t\n\t\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t