{"id":1312,"date":"2025-07-30T14:08:55","date_gmt":"2025-07-30T05:08:55","guid":{"rendered":"https:\/\/umap-corp.com\/en\/?post_type=news&#038;p=1312"},"modified":"2025-07-30T14:14:12","modified_gmt":"2025-07-30T05:14:12","slug":"techno-frontier2025comnext2025","status":"publish","type":"news","link":"https:\/\/umap-corp.com\/en\/news\/techno-frontier2025comnext2025\/","title":{"rendered":"U-MAP to Exhibit at TECHNO-FRONTIER 2025 and COMNEXT 2025!"},"content":{"rendered":"<p><span style=\"font-size: 14pt;\"><strong>Showcasing Thermal Solutions for Next-Generation Communications and Thermal Design<\/strong><\/span><\/p>\n<p>U-MAP is pleased to announce its consecutive participation in two leading industry exhibitions.<br \/>\nAt both events, we are presenting our advanced thermal management solutions utilizing our proprietary fibrous aluminum nitride filler, Thermalnite\u00ae, along with actual product displays.<\/p>\n<p>If you&#8217;re looking for next-generation thermal solutions to address the growing demands of high-output and miniaturized communication modules, we invite you to visit our booth.<\/p>\n<p><strong>\ud83d\udd37 Exhibition #1<\/strong><br \/>\n<strong>TECHNO-FRONTIER 2025 \u2013 Thermal Design &amp; Management Expo<\/strong><br \/>\n\ud83d\udcc5 Date: July 23 (Wed) \u2013 25 (Fri), 2025 | 10:00\u201317:00<br \/>\n\ud83d\udccd Venue: Tokyo Big Sight, West Hall 3<br \/>\n\ud83d\udd22 Booth: 3-BB20 (Co-exhibiting with Okamoto Glass)<br \/>\n\ud83e\udded Zone: Thermal Design &amp; Management Technologies<\/p>\n<p><strong>\ud83d\udd37 Exhibition #2<\/strong><br \/>\n<strong>COMNEXT 2025 \u2013 Next-Gen Communication Technology &amp; Solutions Expo<\/strong><br \/>\n\ud83d\udcc5 Date: July 30 (Wed) \u2013 August 1 (Fri), 2025 | 10:00\u201317:00<br \/>\n\ud83d\udccd Venue: Tokyo Big Sight, South Hall 1<br \/>\n\ud83d\udd22 Booth: C7-9 (Optical Communication World Zone)<br \/>\n\ud83d\udd17 <a href=\"https:\/\/www.cbw-expo.jp\/ja-jp\/register.html?code=1395448406773491-PCT\">Click here to pre-register for COMNEXT<\/a><\/p>\n<p><strong>\ud83d\udd36 Key Products on Display (at both exhibitions)<\/strong><br \/>\n\ud83d\udfe6 High-Strength, High-Thermal-Conductivity Ceramic Substrates (AlN)<br \/>\n\ud83d\udfe8 \u201cFiBCool\u201d Low Thermal Resistance &amp; High Conformability Thermal Sheet<br \/>\n\ud83d\udfe5 Thermalnite\u00ae Hybrid Filler for Z-Axis Thermal Management<\/p>\n<p>As a thermal partner for the future of communications, U-MAP is committed to solving thermal challenges through product development, materials consultation, and collaborative R&amp;D.<\/p>\n<p>We look forward to welcoming you at our booth and discussing how we can support your next innovation.<\/p>\n<p>\ud83d\udce9 For business meeting reservations or inquiries, please contact us here:<br \/>\n<a href=\"https:\/\/umap-corp.com\/contact\">https:\/\/umap-corp.com\/contact<\/a><\/p>\n","protected":false},"featured_media":1313,"template":"","news_category":[8],"class_list":["post-1312","news","type-news","status-publish","has-post-thumbnail","hentry","news_category-others"],"acf":[],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/news\/1312","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/news"}],"about":[{"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/types\/news"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/media\/1313"}],"wp:attachment":[{"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/media?parent=1312"}],"wp:term":[{"taxonomy":"news_category","embeddable":true,"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/news_category?post=1312"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}