{"id":1321,"date":"2025-09-22T14:07:30","date_gmt":"2025-09-22T05:07:30","guid":{"rendered":"https:\/\/umap-corp.com\/en\/?post_type=news&p=1321"},"modified":"2025-09-22T14:12:50","modified_gmt":"2025-09-22T05:12:50","slug":"product-development-support","status":"publish","type":"news","link":"https:\/\/umap-corp.com\/en\/news\/product-development-support\/","title":{"rendered":"\u3010Press-Release\u3011U-MAP Launches Full-Scale Product Development Support"},"content":{"rendered":"

U-MAP Launches Full-Scale Product Development Support Using \u201cThermalnite\u00ae\u201d<\/strong><\/span>
\u2013 From Small-Scale Trials to Joint Development and Mass Production: One-Stop Thermal Management Solutions \u2013<\/span><\/p>\n

\"\"U-MAP Co.,Ltd. (Headquarters: Chikusa-ku, Nagoya, Japan; CEO: Kenji Nishitani), a deep-tech startup originating from Nagoya University, is pleased to announce the official launch of its comprehensive development support services centered around Thermalnite\u00ae, its proprietary fibrous aluminum nitride (AlN) single-crystal filler.
\n<\/em><\/span>By leveraging the unique characteristics of this fibrous filler, U-MAP enables both high thermal conductivity and mechanical strength\u2014difficult to achieve with conventional spherical fillers\u2014even with minimal loading. The company now offers support across all stages, from initial feasibility testing to full-scale co-development and mass production.<\/em><\/span><\/p>\n

\ud83d\udd39 Thermal Management Challenges and the Thermalnite\u00ae Solution
\n<\/strong><\/span>As electric vehicles (EVs), power devices, and 5G\/6G communication modules continue to evolve toward higher power densities, there is a growing demand for advanced thermal interface materials (TIMs), thermal greases, and insulating sheets with exceptionally high thermal conductivity.<\/span>
\nTraditionally, achieving high thermal conductivity has required high filler loading, which introduced several issues:<\/span><\/p>\n

\u30fbReduced mechanical strength: High filler volume makes materials brittle<\/span>
\n\u30fbWorsened thermal performance: Increased interfacial resistance reduces dissipation<\/span>
\n\u30fbManufacturing constraints: High viscosity and poor moldability limit design flexibility<\/span><\/p>\n

Thermalnite\u00ae addresses these challenges through its fibrous morphology, delivering effective performance even with lower filler volume:<\/span><\/p>\n

\u30fbForms continuous thermal pathways for efficient heat dissipation<\/span>
\n\u30fbEnhances through-plane thermal conductivity (e.g., from 10 W\/m\u00b7K to 14 W\/m\u00b7K)<\/span>
\n\u30fbAchieves both strength and flexibility (+290% tensile strength)<\/span>
\n\u30fbReduces interfacial resistance, ensuring long-term thermal stability<\/span><\/p>\n\n\n\n\n\n\n\n\n\n
Comparison Item<\/strong><\/span><\/td>\nConventional Filler (Spherical)<\/strong><\/td>\nThermalnite\u00ae (Fibrous AlN)<\/strong><\/td>\n<\/tr>\n<\/thead>\n
Filler Loading<\/strong><\/span><\/td>\nHigh<\/span><\/td>\nLow<\/span><\/td>\n<\/tr>\n
Thermal Conductivity<\/strong><\/span><\/td>\n\u3007<\/strong><\/span><\/td>\n\u25ce<\/strong><\/span><\/td>\n<\/tr>\n
Mechanical Strength\/Flexibility<\/strong><\/span><\/td>\n\u25b3<\/strong><\/span><\/td>\n\u3007<\/strong><\/span><\/td>\n<\/tr>\n
Structure<\/strong><\/span><\/td>\n\"\"<\/td>\n\"\"<\/td>\n<\/tr>\n
Advantages\/Disadvantages<\/strong><\/span><\/td>\nDifficult to balance conductivity and flexibility due to high filler volume<\/td>\nAchieves both with minimal addition of Thermalnite\u00ae<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

\ud83d\udd39 Case Study: Silicone-Based TIM
\n<\/strong><\/span>In collaborative projects with actual clients, the following improvements have been observed:<\/span><\/p>\n

\u30fbThermal conductivity: +40% (10 \u2192 14 W\/m\u00b7K)<\/span>
\n\u30fbTensile strength: Approx. 3x increase (0.11 \u2192 0.43 MPa)<\/span>
\n\u30fbWorkability: Reduced viscosity due to lower filler content<\/span><\/p>\n

These benefits lead to greater design freedom and faster development cycles.<\/span><\/p>\n

\ud83d\udd39 Support Tailored to Development Stages
\n<\/strong><\/span>U-MAP offers flexible support aligned with each customer\u2019s development phase, beyond simply supplying Thermalnite\u00ae.<\/span><\/p>\n

<Contract Testing><\/strong>
\n<\/span>\u30fbEvaluation of compatibility and basic properties with your resins<\/span>
\n\u30fbSurface treatment and compounding with customer-supplied resins<\/span>
\n*Note: Thermalnite requires specialized conditions to avoid breakage or agglomeration\u2014optimized in-house by U-MAP<\/span>
\n\u30fbMeasurement of thermal conductivity and sample fabrication (sheet, paste)
\n<\/span><Joint Development><\/strong>
\n<\/span>\u30fbCustomizing Thermalnite\u00ae (length\/diameter control) for specific needs<\/span>
\n\u30fbHybridization with other fillers for advanced material design<\/span>
\n\u30fbComprehensive evaluation: thermal conductivity, mechanical strength, dielectric properties, etc.<\/span><\/p>\n

\ud83d\udd39 Target Applications
\n<\/strong><\/span>\u30fbEVs: TIM adhesives for battery modules, thermally conductive encapsulants<\/span>
\n\u30fbCommunication Devices (5G\/6G): RF-compatible TIMs, EMC shielding materials<\/span>
\n\u30fbPower Devices: High-voltage insulating TIMs and sheets<\/span>
\n\u30fbOptoelectronics: LED\/LD sealing materials, thermally conductive adhesives<\/span><\/p>\n

\ud83d\udd39 R&D Capabilities
\n<\/strong><\/span>\u30fbDeep material science expertise from joint research with Nagoya University<\/span>
\n\u30fbFull in-house mixing, dispersion, and evaluation facilities at Nagoya R&D Center<\/span>
\n\u30fbTrack record of selection for NEDO and METI national R&D projects<\/span><\/p>\n

\ud83d\udd39 Message to Industry Partners
\n<\/strong><\/span>From small-scale exploratory trials to full joint development programs, U-MAP is ready to support your innovation journey.<\/span>For companies struggling with heat management or researchers seeking new material solutions, Thermalnite\u00ae offers a breakthrough alternative.<\/span><\/p>\n

\ud83d\udce9 We invite you to contact us and explore collaboration opportunities.<\/span>
\nhttps:\/\/umap-corp.com\/en\/contact\/<\/a><\/span><\/p>\n

\ud83d\udd39 Company Overview
\n<\/strong>U-MAP Co.Ltd.
\nAddress: TOIC 601, Nagoya University, Furo-cho, Chikusa-ku, Nagoya, Japan
\nRepresentative: Kenji Nishitani
\nEstablished: December 12, 2016
\nBusiness: R&D, manufacturing, and sales of advanced thermal interface materials
\nWebsite: https:\/\/umap-corp.com<\/a><\/p>\n

Contact Information
\nBusiness Development Division \u2013 PR & Marketing Group
\nEmail: pres.office@umap-corp.com<\/a><\/p>\n","protected":false},"featured_media":1322,"template":"","news_category":[12],"class_list":["post-1321","news","type-news","status-publish","has-post-thumbnail","hentry","news_category-press-release"],"acf":[],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/news\/1321","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/news"}],"about":[{"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/types\/news"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/media\/1322"}],"wp:attachment":[{"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/media?parent=1321"}],"wp:term":[{"taxonomy":"news_category","embeddable":true,"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/news_category?post=1321"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}