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NOVEMBER 2026 | TOKYO BIG SIGHT | FREE ADMISSION<\/p>\n
U-MAP will exhibit at two exhibitions in Tokyo, and our CEO Kenji Nishitani will speak at both<\/span>.<\/p>\n “The more filler you add, the less usable the material becomes.” We will introduce a new answer to this formulation dilemma: building a pathway for heat with fibers<\/strong>.<\/p>\n<\/div>\n \u2714<\/span> You need higher thermal conductivity, but adding more filler raises viscosity and makes molding difficult<\/strong><\/p>\n \u2714<\/span> High filler loading makes the material hard and brittle<\/strong>, sacrificing flexibility and strength<\/p>\n \u2714<\/span> The measured thermal conductivity improved, yet heat still isn’t dissipated in the actual device<\/strong><\/p>\n \u2714<\/span> You want to add heat dissipation to your own resins, adhesives or films<\/strong> to raise their value<\/p>\n<\/div>\n The root cause may lie in how heat is transferred. Conventional thermal materials rely on loading large amounts of spherical filler and transferring heat through particle-to-particle contact. As a result, the harder you push thermal conductivity, the more the resin loses its processability and flexibility.<\/p>\n U-MAP proposes a new approach: Thermalnite\u00ae, a fibrous aluminum nitride (AlN) single-crystal filler<\/strong>, connects inside the resin to form an efficient pathway for heat\u2014a thermal network<\/strong>. Based on technology developed at Nagoya University, Thermalnite\u00ae is the world’s only fibrous AlN single-crystal filler, manufactured in-house by U-MAP<\/strong>, with mass production already established.<\/p>\n 1. Connects at low loading<\/p>\n High-aspect-ratio fibers link up inside the resin, efficiently forming pathways for heat.<\/p>\n<\/div>\n 2. Keeps the resin’s strengths<\/p>\n Without relying on high filler loading, you can add heat dissipation while maintaining moldability and flexibility.<\/p>\n<\/div>\n 3. Adds strength, too<\/p>\n The fibers also act as reinforcement, improving both thermal conductivity and mechanical strength.<\/p>\n<\/div>\n<\/div>\n Why doesn’t higher thermal conductivity always mean better heat dissipation? What does it mean to “connect with fibers”? Drawing on hands-on materials development experience, Nishitani will explain the concept of thermal network design and share concrete formulation examples using Hybrid Filler. Seminar 1 | N-Plus 2026 Organizer Seminar (NP-05)<\/span><\/p>\n Connect with Fibers, Not Fillers: \ud83d\udcc5 Wednesday, November 11, 2026, 15:30\u201316:15 (JST)<\/strong><\/p>\n \ud83d\udccd N-Plus Organizer Seminar Area, East Hall 2, Tokyo Big Sight<\/p>\n \ud83c\udfa4 Speaker: Kenji Nishitani, CEO, U-MAP Co., Ltd.<\/p>\n \ud83d\udca1 Free. Please complete visitor registration, then select “NP-05” on the seminar registration page. The seminar will be delivered in Japanese.<\/em><\/p>\n Seminar 2 | Chemical Material Japan 2026 Exhibitor Seminar<\/span><\/p>\n Connect with Fibers, Not Fillers: \ud83d\udcc5 Thursday, November 26, 2026, 13:50\u201314:30 (JST)<\/strong><\/p>\n \ud83d\udccd Seminar Room E, South Exhibition Halls, Tokyo Big Sight<\/p>\n \ud83c\udfa4 Speaker: Kenji Nishitani, CEO, U-MAP Co., Ltd.<\/p>\n \ud83d\udca1 Free. 40 seats, first-come, first-served on the day<\/strong>\u2014please arrive early. The seminar will be delivered in Japanese.<\/em><\/p>\n Recommended for<\/p>\n \u30fbEngineers in materials development and formulation design for resins, compounds, adhesives and films<\/p>\n \u30fbThermal design engineers working on EVs, power semiconductors, electronics and data centers<\/p>\n \u30fbAnyone looking to fundamentally solve the trade-off between filler loading and processability<\/p>\n<\/div>\n Hybrid Filler<\/p>\n Up to 15 W\/m\u00b7K (large-particle type, in epoxy)<\/p>\n Combines Thermalnite\u00ae with spherical fillers to balance thermal conductivity and processability. Available in ultra-fine, small and large particle types.<\/p>\n<\/div>\n FIBCOOL Thin-Film Type<\/p>\n 4.6 W\/m\u00b7K \/ 0.1 mm or less<\/p>\n A TIM sheet with an industry-leading thin profile, for thermal management in electronics where thinness matters.<\/p>\n<\/div>\n FIBCOOL High Thermal Conductivity Type<\/p>\n 12.5 W\/m\u00b7K<\/p>\n A TIM sheet for applications that demand high thermal conductivity.<\/p>\n<\/div>\n High-Strength AlN Substrate<\/p>\n 170\u2013230 W\/m\u00b7K<\/p>\n Co-developed with Okamoto Glass Co., Ltd. A ceramic substrate combining high thermal conductivity and mechanical strength.<\/p>\n<\/div>\n<\/div>\n We also offer custom formulation design tailored to your resin and surface treatment, as well as contract testing such as thermal conductivity evaluation. Wondering whether it will work with your material? Ask us at the booth.<\/p>\n\u25b6 Seminars<\/a>\u25b6 Dates & Booths<\/a>\u25b6 Register (Free)<\/a><\/div>\nAre You Facing These Challenges?<\/h2>\n
\nU-MAP’s Answer: Connect with Fibers, Not Fillers<\/h2>\n
\n\n\n\nTwo Seminars by CEO Kenji Nishitani (Free)<\/h2>\n
\nAfter each seminar, you are welcome to visit our booth and talk directly with Nishitani and our team.<\/strong><\/p>\n\n
\nA New Approach to Breaking Through the Limits of Heat Dissipation in Thermal Management<\/p>\nRegister for the Seminar<\/a>\ud83d\udcc5 Add to Google Calendar<\/a><\/div>\n<\/div>\n\n
\nThe New Standard in Thermal Material Design\u2014The “Thermal Network” Enabled by Thermalnite\u00ae, the World’s Only Fibrous AlN Single Crystal<\/p>\n\ud83d\udcc5 Add to Google Calendar<\/a><\/div>\n<\/div>\n\nSee These Products at Our Booth<\/h2>\n
\n\n\n\n\nDates, Venues & Booths<\/h2>\n