{"id":541,"date":"2020-09-04T12:06:42","date_gmt":"2020-09-04T03:06:42","guid":{"rendered":"https:\/\/umap-corp.com\/en\/?page_id=541"},"modified":"2024-02-28T13:50:39","modified_gmt":"2024-02-28T04:50:39","slug":"thermalnite","status":"publish","type":"page","link":"https:\/\/umap-corp.com\/en\/technology\/thermalnite\/","title":{"rendered":"Thermalnite"},"content":{"rendered":"<div class=\"row\">\n<div class=\"col-md-8\">\n<h3 class=\"mt-0\">What is Aluminum Nitride Whisker for Thermal Management?<\/h3>\n<p>Aluminum nitride (AlN) is an electrically insulating ceramic material with a thermal conductivity comparable to that of metallic aluminum.<\/p>\n<p>High aspect ratio single crystals of AlN can be added to resins, rubbers, adhesives, and oils to make insulating composites with low filling ratio and high heat dissipation performance. Materials filled with AlN whiskers (such as high heat-dissipating resin) will make it possible to freely control the thermal path of electronic machines, and enormous energy savings are achieved by eliminating cooling mechanisms. Our research partner, the Ujihara lab, has established a highly efficient mass synthesis method for AlN whiskers.<\/p>\n<\/div>\n<div class=\"col-md-4\"><img decoding=\"async\" class=\"w-100 no-border\" src=\"http:\/\/staging-umapcorp.kinsta.cloud\/wp-content\/uploads\/2021\/02\/image02.png\" alt=\"\" \/><\/div>\n<\/div>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-large wp-image-928\" src=\"http:\/\/staging-umapcorp.kinsta.cloud\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en3-1024x315.jpg\" alt=\"\" width=\"1024\" height=\"315\" srcset=\"https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en3-1024x315.jpg 1024w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en3-300x92.jpg 300w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en3-768x236.jpg 768w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en3-1536x472.jpg 1536w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en3-2048x629.jpg 2048w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/p>\n<p><a class=\"d-block mb-5 mx-auto align-center\" href=\"http:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2024\/02\/U-MAP_Presentation2402_EN1.pdf\" target=\"_blank\" rel=\"noopener\"><button class=\"button button-arrow button--primary\">Download detailed documents (PDF)<\/button><\/a><\/p>\n<h2>Issues<\/h2>\n<h3>1. Managing Heat dissipation with thermal additives<\/h3>\n<p>Heat is the enemy of electronic devices, severely affecting performance and functional life. Improper thermal management can damage any electronic device and create endless headaches for manufacturers. Such issues can have a serious negative impact on a manufacturer\u2019s sales and reputation. The importance of proper thermal management in modern electronic devices cannot be overstated.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-large wp-image-927\" src=\"http:\/\/staging-umapcorp.kinsta.cloud\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en2-1024x346.jpg\" alt=\"\" width=\"1024\" height=\"346\" srcset=\"https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en2-1024x346.jpg 1024w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en2-300x101.jpg 300w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en2-768x260.jpg 768w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en2-1536x519.jpg 1536w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en2-2048x692.jpg 2048w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/p>\n<h3>2.Issues in heat dissipation fillers<\/h3>\n<p>To improve the heat dissipation performance of insulating resin, it is necessary to fill the resin with heat dissipation filler.<br \/>\nConventional technology requires more than 80% filling to achieve high thermal conductivity performance.<br \/>\nTo improve the heat dissipation performance of insulating resin, it is necessary to fill the resin with heat dissipation filler. Conventional technology requires more than 80% filling in order to achieve high thermal conductivity performance. To put it simply, the product is a mass of ceramics, which is difficult to process and to bend.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-large wp-image-929\" src=\"http:\/\/staging-umapcorp.kinsta.cloud\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en4-1024x784.jpg\" alt=\"\" width=\"1024\" height=\"784\" srcset=\"https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en4-1024x784.jpg 1024w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en4-300x230.jpg 300w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en4-768x588.jpg 768w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en4-1536x1175.jpg 1536w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en4-2048x1567.jpg 2048w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><br \/>\n<img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-large wp-image-930\" src=\"http:\/\/staging-umapcorp.kinsta.cloud\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en5-1024x718.jpg\" alt=\"\" width=\"1024\" height=\"718\" srcset=\"https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en5-1024x718.jpg 1024w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en5-300x210.jpg 300w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en5-768x538.jpg 768w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en5-1536x1077.jpg 1536w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en5-2048x1436.jpg 2048w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/p>\n<h2>Comparison with conventional products<\/h2>\n<h3>AlN whisker filler filling pattern<\/h3>\n<p>Let&#8217;s once again compare the heat dissipation behavior of the filling pattern with that of the conventional (AlN\/AlO) spherical filler. The filling pattern is expected to be different depending on the product.<\/p>\n<div class=\"centered\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-large wp-image-931\" src=\"http:\/\/staging-umapcorp.kinsta.cloud\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en6-1024x903.jpg\" alt=\"\" width=\"1024\" height=\"903\" srcset=\"https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en6-1024x903.jpg 1024w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en6-300x265.jpg 300w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en6-768x677.jpg 768w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en6-1536x1355.jpg 1536w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en6-2048x1806.jpg 2048w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/div>\n<h3>Highly efficient synthesis of AlN whiskers by liquid-gas phase growth, showing high heat dissipation performance with low filling.<\/h3>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-large wp-image-926\" src=\"http:\/\/staging-umapcorp.kinsta.cloud\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en1-1024x449.jpg\" alt=\"\" width=\"1024\" height=\"449\" srcset=\"https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en1-1024x449.jpg 1024w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en1-300x132.jpg 300w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en1-768x337.jpg 768w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en1-1536x674.jpg 1536w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en1-2048x899.jpg 2048w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/p>\n<h2>Future Possibilities<\/h2>\n<h3>The heat dissipation filler market will continue to expand<\/h3>\n<p>The global demand for thermal control and heat dissipation components for thermal countermeasures in integrated circuits, LEDs, automobiles, etc. is expanding year by year, and the market is expected to exceed 700 billion yen by 2018.<br \/>\nAlN whisker composites, which are flexible in spite of their high thermal conductivity, will meet these demands.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-large wp-image-933\" src=\"http:\/\/staging-umapcorp.kinsta.cloud\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en8-1024x449.jpg\" alt=\"\" width=\"1024\" height=\"449\" srcset=\"https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en8-1024x449.jpg 1024w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en8-300x132.jpg 300w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en8-768x337.jpg 768w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en8-1536x674.jpg 1536w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en8-2048x899.jpg 2048w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-large wp-image-934\" src=\"http:\/\/staging-umapcorp.kinsta.cloud\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en9-1024x327.jpg\" alt=\"\" width=\"1024\" height=\"327\" srcset=\"https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en9-1024x327.jpg 1024w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en9-300x96.jpg 300w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en9-768x245.jpg 768w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en9-1536x490.jpg 1536w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en9-2048x654.jpg 2048w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><br \/>\n<img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-large wp-image-935\" src=\"http:\/\/staging-umapcorp.kinsta.cloud\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en10-1024x464.jpg\" alt=\"\" width=\"1024\" height=\"464\" srcset=\"https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en10-1024x464.jpg 1024w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en10-300x136.jpg 300w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en10-768x348.jpg 768w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en10-1536x697.jpg 1536w, https:\/\/umap-corp.com\/en\/wp-content\/uploads\/sites\/2\/2021\/06\/umap-corp-image-en10-2048x929.jpg 2048w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/p>\n<h2>Response to future demands<\/h2>\n<p>Demand for insulating resins in the 50W\/mK class is expected in the future, and AlN whisker fillers will demonstrate metal-level capabilities to meet the coming future.<\/p>\n<div class=\"row\">\n<div class=\"col-md-4 align-center\">\n<p><img decoding=\"async\" class=\"w-100 mb-2\" src=\"http:\/\/staging-umapcorp.kinsta.cloud\/wp-content\/uploads\/2021\/02\/image10.png\" \/>Innovative device design to improve battery performance<\/p>\n<\/div>\n<div class=\"col-md-4 align-center\">\n<p><img decoding=\"async\" class=\"w-100 mb-2\" src=\"http:\/\/staging-umapcorp.kinsta.cloud\/wp-content\/uploads\/2021\/02\/image11.png\" \/>Designing for Wide Vehicle Interiors, Realizing Low Temperature Difference Circuits<\/p>\n<\/div>\n<div class=\"col-md-4 align-center\">\n<p><img decoding=\"async\" class=\"w-100 mb-2\" src=\"http:\/\/staging-umapcorp.kinsta.cloud\/wp-content\/uploads\/2021\/02\/image12.png\" \/>Designing for extreme conditions, building ultimate reliability<\/p>\n<\/div>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>What is Aluminum Nitride Whisker for Thermal Management? Aluminum nitride (AlN) is an electrically insulating ceramic material with a thermal conductivity comparable to that of metallic aluminum. High aspect ratio single crystals of AlN can be added to resins, rubbers, adhesives, and oils to make insulating composites with low filling ratio and high heat dissipation [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":11,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-541","page","type-page","status-publish","hentry"],"acf":[],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/pages\/541","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/comments?post=541"}],"version-history":[{"count":23,"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/pages\/541\/revisions"}],"predecessor-version":[{"id":1231,"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/pages\/541\/revisions\/1231"}],"up":[{"embeddable":true,"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/pages\/11"}],"wp:attachment":[{"href":"https:\/\/umap-corp.com\/en\/wp-json\/wp\/v2\/media?parent=541"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}