The increasing problem of thermal issues in electronic devices

As mobile devices become more widespread and mobility becomes more electric, the need for higher performance and smaller devices is increasing.

As a result, the amount and density of heat generated by electronic devices is increasing, and heat dissipation problems are occurring in all industrial fields. Heat generation is a major enemy of electronic devices, and it is a problem that can lead to poor performance, reduced device life, and deteriorating reliability such as fire accidents. Conventionally, air and water cooling systems such as fans and chillers have been used to dissipate heat, but these forced cooling systems lead to larger equipment and increased energy consumption.

Therefore, it is important to make the equipment components highly thermally conductive so that they can efficiently dissipate heat with the power of the materials themselves. The key materials for equipment components are ceramics and resin/rubber materials.

Thermalnite, a key material for heat dissipation

Additives called "fillers" are the key to improving the performance of ceramics and resin materials. At U-MAP, we have developed an innovative filler material, Thermalnite (fibrous aluminum nitride single crystal).

With just a little bit of mixing, it is possible to improve thermal conductivity and mechanical strength to achieve new functional materials that have never existed before. Lighter and easier to process materials, with higher mechanical strength and less fragile materials. Lighter smartphones, longer lasting batteries, and materials that can be used in industrial and aerospace equipment in harsh environments.

A New Material Development Model for U-MAP

Aiming for a smart society with thermal control.

Electricity is indispensable in our daily lives. Power and heat are closely related. Heat generation reduces the efficiency of the CPU, so more power is needed to perform the same processing. In addition, in data centers, where power consumption is an issue, nearly half of the power consumed is used to cool the servers. It is said that the power used for this cooling already accounts for nearly 1% of the world's total power consumption, and there are predictions that it will increase to 10% by 2030.

By solving the heat problem, we will contribute to the world's energy problems. This is the future that U-MAP is aiming for.

Job Opportunities

U-MAP is a materials venture born from a university laboratory.

In order to become a role model for entrepreneurship from university laboratories, we are looking for new ways of doing things, not only in handling new materials, but also in the development process and commercialization system. We are looking for people who are enthusiastic and want to take on new challenges, regardless of their past experience or field.