We are pleased to announce that U-MAP will be exhibiting at NEPCON Japan 2026, taking place from January 21 to 23 at Tokyo Big Sight.

This exhibition showcases thermal management solutions centered around our proprietary filler “Thermalnite®,” now in mass production.
We will display next-generation technologies contributing to the high performance and miniaturization of electronic devices, including thermal sheets and ceramic substrates.
A new high thermal conductivity sheet, making its debut at this exhibition, will also be featured.
We sincerely look forward to your visit.

📍 Visit us at Booth E39-44
🔗 https://www.nepconjapan.jp/tokyo/en-gb/register.html?code=1552887782280065-5BS

🔔 Holiday Closure Notice
Our office will be closed from December 27, 2025 to January 4, 2026.
We will resume business on January 5.