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[Exhibition & Seminar Notice] U-MAP to Exhibit at High-Performance Materials Week 2026 (September 30–October 2, 2026, Makuhari Messe)

U-MAP Co., Ltd. will exhibit at High-Performance Materials Week 2026 (1st High-Performance Materials Expo), taking place September 30 (Wed) through October 2 (Fri), 2026, at Makuhari Messe. President Kenji Nishitani will also deliver an exhibitor seminar during the show.

■ Exhibits

U-MAP takes a new approach to thermal management: designing a fiber-based Thermal Network that creates an efficient path for heat to escape, rather than relying on conventional particle-filler loading. The following products will be on display.

  • Thermalnite® (the world’s only fibrous AlN single-crystal filler)
  • Hybrid Filler (combines Thermalnite® with spherical filler to achieve both high thermal conductivity and processability)
  • FIBCOOL Thin-Film Type (formerly: Low Thermal Resistance Sheet / thermal conductivity 4.6 W/m·K, industry-leading thin profile under 0.1 mm)
  • FIBCOOL High Thermal Conductivity Type (formerly: High Thermal Conductivity Sheet / thermal conductivity 12 W/m·K)
  • High-Strength AlN Substrate (co-developed with Okamoto Glass Co., Ltd. / thermal conductivity 170–230 W/m·K)

The High-Strength AlN Substrate was co-developed with Okamoto Glass Co., Ltd., and a representative from Okamoto Glass will be on-site during the show to help explain the product.

■ Exhibitor Seminar

“Why Doesn’t Higher Thermal Conductivity Mean Better Heat Dissipation? — How Thermalnite® Enables Thermal Network Design”
Speaker: Kenji Nishitani, President, U-MAP Co., Ltd.
Date & Time: October 1 (Thu), 2026, 13:30–14:15
Venue: Next Tech STAGE A

This session addresses a challenge that higher thermal conductivity alone cannot solve, introducing the Thermal Network — a fiber-based “path for heat to escape” — through Hybrid Filler material design. Rather than relying on high loading of particle fillers, this approach achieves thermal conductivity together with processability and mechanical strength, offering practical takeaways for thermal design engineers in EVs, electronics, and semiconductors.

To register for the seminar, please follow these steps:
① Visit the seminar program page (https://www.material-expo.jp/tokyo/en-gb/conference.html)
② Select “New Technology Seminars by Exhibitors”
③ Find and register for U-MAP’s session

■ Event Overview
Exhibition: High-Performance Materials Week 2026 (1st High-Performance Materials Expo)
Dates: September 30 (Wed) – October 2 (Fri), 2026
Venue: Makuhari Messe
Booth: 14-14
Organizer: RX Japan Ltd.

Note: General visitor registration will require a paid ticket (¥5,000) starting September 5. Visitors who register through the invitation link below can attend free of charge throughout the event.
▶ Free registration: [invitation URL]

Contact: U-MAP Co., Ltd. / info@umap-corp.com