U-MAP Inc. (Headquarters: Nagoya, Aichi, Japan; Representative Director: Kenji Nishitani; “U-MAP”) and Tanaka Seimitsu Kogyo Co., Ltd. (Headquarters: Toyama, Japan; Representative Director, President and Executive Officer: Eiichiro Tanaka; “Tanaka Seimitsu Kogyo”) have concluded a capital and business alliance agreement, effective September 28, 2026.

Through this alliance, the two companies will combine U-MAP’s new material Thermalnite® with Tanaka Seimitsu Kogyo’s design, precision machining, and mass-production technologies, with the aim of creating new businesses in thermal management for electric vehicles (EVs) and data centers.

■ Background and Purpose

As EV adoption and data center demand continue to grow, power semiconductors are becoming ever more powerful and densely integrated, making heat dissipation and cooling technologies a key factor in product performance and reliability.

U-MAP, a startup originating from Nagoya University, develops and manufactures thermal management materials that combine high thermal conductivity with electrical insulation, built around its new material Thermalnite®, a Fibrous Aluminum Nitride Single Crystal.

Tanaka Seimitsu Kogyo, drawing on the manufacturing expertise it has built in the automotive parts business, excels at translating customers’ functional and performance requirements into product designs and supporting the entire process from performance evaluation to mass-production quality assurance.

By combining materials technology with productization technology, the two companies aim to develop thermal management materials into practical cooling components and modules, opening up new markets.

This alliance is also part of Tanaka Seimitsu Kogyo’s efforts to transform its business portfolio under its long-term management plan, “Next35.”

■ Details of the Alliance

1. Capital Alliance

Tanaka Seimitsu Kogyo has subscribed to a third-party allotment of new shares issued by U-MAP (the investment amount is not disclosed). Through this investment, the two companies will build a medium- to long-term collaborative relationship.

2. Business Alliance

Leveraging both companies’ technologies, the partners will conduct joint verification toward the practical application of heat dissipation and cooling technologies for next-generation power semiconductors used in EVs and data centers. Specific verification themes and evaluation details are not disclosed.

■ Future Outlook

To turn “better” into reality, the two companies will work on developing next-generation cooling modules that are “lighter and cool better.”

Using existing products in the automotive inverter field as of 2025 as a reference, they have set a development target of halving the weight of the cooling system. At the same time, they will pursue improved cooling performance and optimal designs tailored to each customer’s requirements, including thinner and smaller form factors, strength, and reliability.

Through repeated verification for practical application covering quality, cost, and mass producibility, the companies aim to commercialize the technology by 2030.

■ Comments from the Representatives

Kenji Nishitani, Representative Director, U-MAP Inc.

“Through our alliance with Tanaka Seimitsu Kogyo, we are taking a major step toward turning the performance of Thermalnite® as a material into value delivered in real products and systems. By combining U-MAP’s materials technology with Tanaka Seimitsu Kogyo’s design, machining, and mass-production expertise, we aim to realize new thermal solutions that go beyond materials alone. Toward our vision of ‘solving the world’s thermal problems with new materials,’ the two companies will accelerate technical verification and commercialization.”

Eiichiro Tanaka, Representative Director, President and Executive Officer, Tanaka Seimitsu Kogyo Co., Ltd.

“Guided by our Group Purpose, ‘Moving hearts, creating the future,’ we are working to create new value and transform our business portfolio through our long-term management plan, ‘Next35.’ This alliance puts those efforts into concrete action and represents our challenge in the growing field of thermal management. By combining U-MAP’s advanced thermal management material technology with our design, precision machining, and mass-production technologies, as well as our expertise in performance evaluation and quality assurance, we will deliver new value for the thermal challenges of next-generation power semiconductors and grow this into a new business pillar that supports future mobility and social infrastructure.”

■ Company Profiles

U-MAP Inc.

Headquarters: Tokai Open Innovation Complex (TOIC) 601, Furo-cho, Chikusa-ku, Nagoya, Aichi, Japan
Established: December 12, 2016
Representative: Kenji Nishitani, Representative Director
Business: Development, manufacturing, and sales of thermal management materials (TIM sheets, grease, ceramic substrates, etc.) based on Thermalnite®, a highly thermally conductive Fibrous Aluminum Nitride Single Crystal
URL: https://umap-corp.com/en/

Tanaka Seimitsu Kogyo Co., Ltd.

Headquarters: 328 Shimada, Fuchu-machi, Toyama, Toyama, Japan
Established: October 1, 1957 (Founded: March 1948)
Representative: Eiichiro Tanaka, Representative Director, President and Executive Officer
Business: Manufacturing and sales of automotive parts, motorcycle parts, general-purpose parts, aerospace parts, etc.
Listing: Tokyo Stock Exchange Standard Market (Securities code: 7218)
URL: https://www.tanasei.co.jp/

*Thermalnite is a registered trademark of U-MAP Inc.

■ Contact

U-MAP Inc.

Public Relations
E-mail: pres.office@umap-corp.com
Contact form: https://umap-corp.com/en/contact/

Tanaka Seimitsu Kogyo Co., Ltd.

Business Strategy Office, Parts Manufacturing Division: Tomoya Takata, General Manager
E-mail: tomoya_takata@tanasei.co.jp

*This is an English translation of the original Japanese press release. In the event of any discrepancy, the Japanese version shall prevail.