NOVEMBER 2026 | TOKYO BIG SIGHT | FREE ADMISSION
U-MAP will exhibit at two exhibitions in Tokyo, and our CEO Kenji Nishitani will speak at both.
“The more filler you add, the less usable the material becomes.” We will introduce a new answer to this formulation dilemma: building a pathway for heat with fibers.
Are You Facing These Challenges?
✔ You need higher thermal conductivity, but adding more filler raises viscosity and makes molding difficult
✔ High filler loading makes the material hard and brittle, sacrificing flexibility and strength
✔ The measured thermal conductivity improved, yet heat still isn’t dissipated in the actual device
✔ You want to add heat dissipation to your own resins, adhesives or films to raise their value
The root cause may lie in how heat is transferred. Conventional thermal materials rely on loading large amounts of spherical filler and transferring heat through particle-to-particle contact. As a result, the harder you push thermal conductivity, the more the resin loses its processability and flexibility.
U-MAP’s Answer: Connect with Fibers, Not Fillers
U-MAP proposes a new approach: Thermalnite®, a fibrous aluminum nitride (AlN) single-crystal filler, connects inside the resin to form an efficient pathway for heat—a thermal network. Based on technology developed at Nagoya University, Thermalnite® is the world’s only fibrous AlN single-crystal filler, manufactured in-house by U-MAP, with mass production already established.
1. Connects at low loading
High-aspect-ratio fibers link up inside the resin, efficiently forming pathways for heat.
2. Keeps the resin’s strengths
Without relying on high filler loading, you can add heat dissipation while maintaining moldability and flexibility.
3. Adds strength, too
The fibers also act as reinforcement, improving both thermal conductivity and mechanical strength.
Two Seminars by CEO Kenji Nishitani (Free)
Why doesn’t higher thermal conductivity always mean better heat dissipation? What does it mean to “connect with fibers”? Drawing on hands-on materials development experience, Nishitani will explain the concept of thermal network design and share concrete formulation examples using Hybrid Filler.
After each seminar, you are welcome to visit our booth and talk directly with Nishitani and our team.
Seminar 1 | N-Plus 2026 Organizer Seminar (NP-05)
Connect with Fibers, Not Fillers:
A New Approach to Breaking Through the Limits of Heat Dissipation in Thermal Management
📅 Wednesday, November 11, 2026, 15:30–16:15 (JST)
📍 N-Plus Organizer Seminar Area, East Hall 2, Tokyo Big Sight
🎤 Speaker: Kenji Nishitani, CEO, U-MAP Co., Ltd.
💡 Free. Please complete visitor registration, then select “NP-05” on the seminar registration page. The seminar will be delivered in Japanese.
Seminar 2 | Chemical Material Japan 2026 Exhibitor Seminar
Connect with Fibers, Not Fillers:
The New Standard in Thermal Material Design—The “Thermal Network” Enabled by Thermalnite®, the World’s Only Fibrous AlN Single Crystal
📅 Thursday, November 26, 2026, 13:50–14:30 (JST)
📍 Seminar Room E, South Exhibition Halls, Tokyo Big Sight
🎤 Speaker: Kenji Nishitani, CEO, U-MAP Co., Ltd.
💡 Free. 40 seats, first-come, first-served on the day—please arrive early. The seminar will be delivered in Japanese.
Recommended for
・Engineers in materials development and formulation design for resins, compounds, adhesives and films
・Thermal design engineers working on EVs, power semiconductors, electronics and data centers
・Anyone looking to fundamentally solve the trade-off between filler loading and processability
See These Products at Our Booth
Hybrid Filler
Up to 15 W/m·K (large-particle type, in epoxy)
Combines Thermalnite® with spherical fillers to balance thermal conductivity and processability. Available in ultra-fine, small and large particle types.
FIBCOOL Thin-Film Type
4.6 W/m·K / 0.1 mm or less
A TIM sheet with an industry-leading thin profile, for thermal management in electronics where thinness matters.
FIBCOOL High Thermal Conductivity Type
12.5 W/m·K
A TIM sheet for applications that demand high thermal conductivity.
High-Strength AlN Substrate
170–230 W/m·K
Co-developed with Okamoto Glass Co., Ltd. A ceramic substrate combining high thermal conductivity and mechanical strength.
We also offer custom formulation design tailored to your resin and surface treatment, as well as contract testing such as thermal conductivity evaluation. Wondering whether it will work with your material? Ask us at the booth.
Dates, Venues & Booths
| N-Plus 2026 | Chemical Material Japan 2026 | |
|---|---|---|
| Dates | November 11–13 (Wed–Fri) 10:00–17:00 |
November 26–27 (Thu–Fri) 10:00–17:00 |
| Venue | Tokyo Big Sight East Hall 2 |
Tokyo Big Sight South Halls 1 & 2 |
| Booth | A-42 Within the KTR Exchange Plaza |
C-68 U-MAP solo booth (corner booth) |
| Seminar | Nov 11 (Wed), 15:30– | Nov 26 (Thu), 13:50– |
| Admission | Free (advance registration required) | Free (advance registration required) |
Visit Us in 3 Steps
1
Complete free visitor registration on each exhibition’s official website
2
For N-Plus, select “NP-05” on the seminar registration page (Chemical Material Japan: first-come, first-served)
3
On the day, bring your visitor badge and come to Booth A-42 / C-68
Visitor Registration (Free) ▶Chemical Material Japan 2026
Official Website & Registration (Free) ▶
FAQ
Q. Is there a fee for admission or the seminars?
A. Both exhibitions are free with advance visitor registration, and the seminars are also free.
Q. Are the seminars available in English?
A. Both seminars will be delivered in Japanese. If you would like to talk with us at the booth, please contact us in advance and we will do our best to arrange your visit.
Q. Can I visit the booth without attending a seminar?
A. Of course. You can see our products and consult with us at the booth anytime during the exhibition.
Q. What if I can’t come to Tokyo?
A. Technical documents are available for download on our website. For individual inquiries, please use our contact form.
Your thermal challenge may have a fiber-based solution.
We look forward to seeing you at Tokyo Big Sight.
Contact: U-MAP Co., Ltd. (pres.office@umap-corp.com)
