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Join U-MAP at “NEPCON Japan 2025” – Co-exhibiting with Okamoto Glass Co., Ltd. at Tokyo Big Sight!
Event Details
Name: The 39th NEPCON Japan 2025
Date: January 22 (Wed) – 24 (Fri), 2025 | 10:00 AM – 5:00 PM
Venue: Tokyo Big Sight
Booth: East Hall 7, E68-33
Highlighted New Product
▶ High Thermal Conductivity Sheet
“Combining High Thermal Conductivity and Flexibility!”
- Industry-leading thermal conductivity of 14W/m·K
- Innovative filler design achieves flexibility and resilience
(Details to be released just before the exhibition!)
Other Featured Products
▶ Low Thermal Resistance Sheet
- Enhanced with new material Thermalnite®
- Achieves industry-low thermal resistance (15% reduction)
- Ultra-thin 0.1mm with insulation properties
- Mechanical strength improved by 4x over conventional products
▶ High-Strength AlN Substrate [Co-developed with Okamoto Glass]
- 2x fracture toughness (5.5MPa·m1/2)
- Thermal conductivity over 200W/m·K
▶ Fibrous AlN Filler
- Featuring U-MAP’s proprietary Thermalnite® technology
▶ New Hybrid Filler
- Combines Thermalnite® with spherical particles
▶ Water-Resistant AlN Filler
- Surface-treated Thermalnite® for enhanced water resistance
Registration Required for Entry
(Click here to register)
Exhibitor Page
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About Power Device & Module EXPO
A specialized exhibition showcasing the latest technologies and products in power devices and modules. This event provides an excellent platform to explore components, materials, and manufacturing equipment, attracting professionals from related industries worldwide.
Learn more about the exhibition.
Don’t miss U-MAP’s cutting-edge thermal management solutions!