U-MAP will exhibit at “NEPCON JAPAN 2024” at Tokyo Big Sight!

U-MAP will exhibit jointly at the 1st Power Devices & Modules EXPO at “NEPCON JAPAN 2024” to be held at Tokyo Big Sight from January 24th to 26th, 2024!

Exhibit details (jointly with Okamoto Glass Co., Ltd.):
 Thin film TIM sheet with low thermal resistance
 High strength AlN substrate
 AlN whisker (Thermalnite®)
 AlN Whisker with improved water resistance

 New product unveiled for the first time!
 We have successfully developed an insulating TIM sheet with low thermal resistance!
 Visit us at our booth for further advantages.

Exhibition Name: NEPCON JAPAN 2024 @ Tokyo Big Sight
Period: 2024/1/24-26
*Reservations to visit the exhibition are required! (Reservation)

U-MAP Exhibit Booth: East Hall 6, E55-11
U-MAP Booth Location
Click here for exhibitor page

The Power Devices & Modules Expo is a specialized exhibition where the latest technologies and products of the rapidly expanding power devices and modules market gather under one roof.
It is a must-attend event for manufacturers of electronics, semiconductors, sensors, electronic components, power devices and modules, automobiles and electrical components
electronics, semiconductors, sensors, electronic components, power devices/modules, automobiles, and electrical components manufacturers from Japan and abroad!
Click here for exhibition details

Don’t miss U-MAP’s latest “Heat Dissipation Sheet Solution”!