U-MAP will exhibit jointly at the 1st Power Devices & Modules EXPO at “NEPCON JAPAN 2024” to be held at Tokyo Big Sight from January 24th to 26th, 2024!

Exhibit details (jointly with Okamoto Glass Co., Ltd.):
　Thin film TIM sheet with low thermal resistance
　High strength AlN substrate
　AlN whisker (Thermalnite®)
　AlN Whisker with improved water resistance

Highlights:
　New product unveiled for the first time!
　We have successfully developed an insulating TIM sheet with low thermal resistance!
　Visit us at our booth for further advantages.

Exhibition Name: NEPCON JAPAN 2024 @ Tokyo Big Sight
Period: 2024/1/24-26
*Reservations to visit the exhibition are required! (Reservation)

U-MAP Exhibit Booth: East Hall 6, E55-11
U-MAP Booth Location
Click here for exhibitor page

The Power Devices & Modules Expo is a specialized exhibition where the latest technologies and products of the rapidly expanding power devices and modules market gather under one roof.
It is a must-attend event for manufacturers of electronics, semiconductors, sensors, electronic components, power devices and modules, automobiles and electrical components
electronics, semiconductors, sensors, electronic components, power devices/modules, automobiles, and electrical components manufacturers from Japan and abroad!
Click here for exhibition details

Don’t miss U-MAP’s latest “Heat Dissipation Sheet Solution”!