What is Aluminum Nitride Whisker for Thermal Management?
Aluminum nitride (AlN) is an electrically insulating ceramic material with a thermal conductivity comparable to that of metallic aluminum.
High aspect ratio single crystals of AlN can be added to resins, rubbers, adhesives, and oils to make insulating composites with low filling ratio and high heat dissipation performance. Materials filled with AlN whiskers (such as high heat-dissipating resin) will make it possible to freely control the thermal path of electronic machines, and enormous energy savings are achieved by eliminating cooling mechanisms. Our research partner, the Ujihara lab, has established a highly efficient mass synthesis method for AlN whiskers.
Issues
1. Managing Heat dissipation with thermal additives
Heat is the enemy of electronic devices, severely affecting performance and functional life. Improper thermal management can damage any electronic device and create endless headaches for manufacturers. Such issues can have a serious negative impact on a manufacturer’s sales and reputation. The importance of proper thermal management in modern electronic devices cannot be overstated.
2.Issues in heat dissipation fillers
To improve the heat dissipation performance of insulating resin, it is necessary to fill the resin with heat dissipation filler.
Conventional technology requires more than 80% filling to achieve high thermal conductivity performance.
To improve the heat dissipation performance of insulating resin, it is necessary to fill the resin with heat dissipation filler. Conventional technology requires more than 80% filling in order to achieve high thermal conductivity performance. To put it simply, the product is a mass of ceramics, which is difficult to process and to bend.
Comparison with conventional products
AlN whisker filler filling pattern
Let’s once again compare the heat dissipation behavior of the filling pattern with that of the conventional (AlN/AlO) spherical filler. The filling pattern is expected to be different depending on the product.
Highly efficient synthesis of AlN whiskers by liquid-gas phase growth, showing high heat dissipation performance with low filling.
Future Possibilities
The heat dissipation filler market will continue to expand
The global demand for thermal control and heat dissipation components for thermal countermeasures in integrated circuits, LEDs, automobiles, etc. is expanding year by year, and the market is expected to exceed 700 billion yen by 2018.
AlN whisker composites, which are flexible in spite of their high thermal conductivity, will meet these demands.
Response to future demands
Demand for insulating resins in the 50W/mK class is expected in the future, and AlN whisker fillers will demonstrate metal-level capabilities to meet the coming future.
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