“U-MAP Establishing a Stable Supply System for High-Heat-Generating Devices“
-July 15, 2026 –
U-MAP Co., Ltd. (Head Office: Chikusa-ku, Nagoya, Aichi Prefecture; CEO: Kenji Nishitani) is pleased to announce that its proprietary aluminum nitride (AlN) heat-dissipating substrate has been officially qualified for mass production by a domestic substrate manufacturer. This milestone ensures a stable supply framework for applications such as laser diodes (LD), optical communication transceivers, LED lighting, and thermoelectric modules.
＃Meeting the Demands of the Thermal Era
Since its founding, U-MAP has focused on addressing the root challenges of thermal management in electronic devices. We have now successfully built a system capable of mass-producing and stably supplying high-performance heat-dissipating materials.
As electronic devices continue to evolve toward higher output and greater integration, thermal management has become a critical design factor. In particular, heat-generating components used in optoelectronics and power devices require highly reliable heat-dissipating substrates.
Aluminum nitride (AlN) substrates, offering both excellent insulation and thermal conductivity around 170 W/m·K, are widely adopted in high-reliability applications such as LD submounts, LED lighting, and thermoelectric modules. Laser diodes, which are increasingly used in data centers and telecommunications infrastructure, also benefit significantly from AlN’s superior heat dissipation capabilities.
Left and right images: Examples of adoption for LD submount applications
＃Fulfilling the Final Requirement for Market Adoption
In parallel with our materials R&D, U-MAP has also developed a production system and quality assurance framework aimed at the mass manufacturing of secondary products using these materials, such as AlN-based heat-dissipating substrates.
The newly acquired mass production qualification recognizes that our product surpasses the prototype stage and is now a commercially viable solution. This was determined based on evaluations of production stability, defect rates, operational efficiency, standardized inspection protocols, and process-specific quality control. In other words, our product has been validated for its reliability, reproducibility, and continuity—core factors for stable supply in the market.
＃Earning Trust through Supply Stability
We believe that being chosen in the marketplace depends not only on technical innovation and product differentiation, but also on the ability to consistently deliver high-quality products over time.
This mass production qualification marks a new phase in U-MAP’s growth—from a research-driven startup to a company capable of meeting real-world industrial demands with a fully developed production infrastructure.
In addition to our 170 W/m·K class products, we are actively developing even higher-performance substrates with thermal conductivities of 200 W/m·K and 230 W/m·K. These advancements are being pursued with a forward-looking approach, anticipating future market needs.
Furthermore, evaluations and adoption discussions are already underway with overseas manufacturers, particularly in Taiwan.
＃Product Information and Evaluation Samples
Product catalogs and evaluation samples are available upon request, tailored to your application or stage of consideration.
For inquiries or consultations, please feel free to contact us via the information below.
《Company Overview》
Company Name: U-MAP Co.,Ltd.
Address: TOIC 601, Nagoya University, Furo-cho, Chikusa-ku, Nagoya, Japan
Representative: Kenji Nishitani, CEO
Established: December 12, 2016
Business Activities: R&D, manufacturing, and sales of high thermal conductivity material “Thermalnite®”
Website: https://umap-corp.com/
《Contact Information》
Business Development Division – PR & Marketing Group
Contact Person: Rie Yamada
Email: pres.office@umap-corp.com
Contact Form: https://umap-corp.com/contact
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《Joint Exhibition with Okamoto Glass at Two Trade Shows in July & August!》
【TECHNO-FRONTIER 2025 – Thermal Design and Management Expo】
Dates: July 23 (Wed) – 25 (Fri), 2025 | 10:00 AM – 5:00 PM
Venue: Tokyo Big Sight
[Pre-registration Form]
【COMNEXT 2025 – Next Generation Communication Technology & Solutions Expo】
Dates: July 30 (Wed) – August 1 (Fri), 2025 | 10:00 AM – 5:00 PM
Venue: Tokyo Big Sight
[Pre-registration Form]
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≪Inquiries & On-site Meeting Reservations≫
If you would like to reserve a meeting at the venue in advance,
please contact us via the form below with your preferred date/time of visit and any specific requests.
Contact Form: https://umap-corp.com/contact
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