On May 13, 2019, U-MAP President Nishitani gave a presentation at the “Joint Briefing Session on Collaboration with Nagoya University Venture Companies”, a technical support event for venture companies held at Mitsubishi UFJ Bank Hirokoji Cross Tower.
At this briefing, we introduced the use of a new material that efficiently releases heat from electronic devices to over 100 people who attended the event. The presentation was followed by an interview with a reporter, the contents of which can be found at the following URL.
■NHK
https://www3.nhk.or.jp/tokai-news/20190513/0004652.html
■Nihon Keizai Shimbun
https://www.nikkei.com/article/DGKKZO44730230T10C19A5L91000/
■The Chunichi Shimbun
