Showcasing Thermal Solutions for Next-Generation Communications and Thermal Design
U-MAP is pleased to announce its consecutive participation in two leading industry exhibitions.
At both events, we are presenting our advanced thermal management solutions utilizing our proprietary fibrous aluminum nitride filler, Thermalnite®, along with actual product displays.
If you’re looking for next-generation thermal solutions to address the growing demands of high-output and miniaturized communication modules, we invite you to visit our booth.
🔷 Exhibition #1
TECHNO-FRONTIER 2025 – Thermal Design & Management Expo
📅 Date: July 23 (Wed) – 25 (Fri), 2025 | 10:00–17:00
📍 Venue: Tokyo Big Sight, West Hall 3
🔢 Booth: 3-BB20 (Co-exhibiting with Okamoto Glass)
🧭 Zone: Thermal Design & Management Technologies
🔷 Exhibition #2
COMNEXT 2025 – Next-Gen Communication Technology & Solutions Expo
📅 Date: July 30 (Wed) – August 1 (Fri), 2025 | 10:00–17:00
📍 Venue: Tokyo Big Sight, South Hall 1
🔢 Booth: C7-9 (Optical Communication World Zone)
🔗 Click here to pre-register for COMNEXT
🔶 Key Products on Display (at both exhibitions)
🟦 High-Strength, High-Thermal-Conductivity Ceramic Substrates (AlN)
🟨 “FiBCool” Low Thermal Resistance & High Conformability Thermal Sheet
🟥 Thermalnite® Hybrid Filler for Z-Axis Thermal Management
As a thermal partner for the future of communications, U-MAP is committed to solving thermal challenges through product development, materials consultation, and collaborative R&D.
We look forward to welcoming you at our booth and discussing how we can support your next innovation.
📩 For business meeting reservations or inquiries, please contact us here:
https://umap-corp.com/contact
