U-MAP CEO Nishitani will give an online presentation at
“The 6th Ceramic Substrate and Packaging Industry Summit Forum” in China on June 30!
Don’t miss it! *There is a fee for this event and it will be held onsite.
Lecture (Simultaneous Chinese interpretation): “High Strength AlN Substrates and Fibrous Aluminum Nitride Single Crystals (Thermalnite)
The development of aluminum nitride substrates and Thermalnite fibers has improved fracture toughness and thermal conductivity to an amazing level. In the presentation, the results will be introduced in detail.
Name: 6th Ceramic Substrate and Packaging Industry Summit Forum @ China
Duration: June 30, 2023
Click here for detail！！