Press-release

【Press Release】 Thermal Material Startup U-MAP Co., Ltd. Announces New Product: “High Thermal Conductivity Heat Dissipation Sheet”

January 17, 2025 –

Introducing a Revolutionary New Product for Thermal Management!

Combining Industry-Leading Thermal Conductivity and Flexibility Through Optimal Filler Design!

U-MAP Co., Ltd. (Headquarters: Nagoya, Aichi, Japan), a thermal materials startup originating from Nagoya University, announces the launch of its new “Thermalnite® High Thermal Conductivity Heat Dissipation Sheet.” This groundbreaking product achieves an industry-leading thermal conductivity of 14 W/(m·K) while maintaining exceptional flexibility, dramatically enhancing heat dissipation performance for power modules, CPUs, GPUs, and more.


New Product

Thermalnite® High Thermal Conductivity Heat Dissipation Sheet

Key Features

High Thermal Conductivity (14 W/(m·K)): Maximizes heat dissipation across devices.
Flexibility: Ensures superior adhesion, absorbing dimensional tolerances between components.
Resilience: Maintains low thermal resistance under vibration or thermal deformation.
Low Thermal Resistance: Delivers outstanding performance even under low pressure, protecting components.


Applications

Between Power Modules and Heat Sinks
▻ Exceptional thermal conductivity and resilience accommodate substrate warping caused by thermal deformation.
▻ Maintains excellent thermal resistance, maximizing heat dissipation for high-output devices.

Between CPUs, GPUs, and Heat Sinks
▻ Combines flexibility and thermal conductivity to cool multiple components effectively with a single sheet.
▻ Reduces damage to components with its soft and adaptive material, suitable for a wide range of tolerances.
▻ Absorbs dimensional variations in IC chips, enhancing system reliability.


Problem-Solving Capabilities

Substrate Warping Due to Thermal Deformation: Maintains superior thermal resistance through high conductivity and resilience.

Absorption of IC Tolerance: Soft material prevents damage and absorbs dimensional variations in components.


Unveiling at NEPCON Japan 2025

Be the first to see this product at NEPCON Japan 2025, held from January 22, 2025.
Visit our booth for live demonstrations and to experience the product firsthand!

  • Event Details:
    Dates: January 22 (Wed) – 24 (Fri), 2025 | 10:00–17:00
    Location: Tokyo Big Sight, East Hall 7, Booth E68-33
    Event Info: Click here

Company Overview

U-MAP Co., Ltd.
Address:
Tokai Open Innovation Complex (TOIC), 6th Floor, Open Lab 601
Furo-cho, Chikusa-ku, Nagoya, Aichi, 464-8601, Japan
Website: https://umap-corp.com

Founded in December 2016 as a material startup from Nagoya University, U-MAP, under the leadership of CEO Kenji Nishitani, develops advanced fiber-shaped aluminum nitride single crystals and thermal management materials for the electronics and high-tech industries, delivering unparalleled heat dissipation performance.


Contact Information

U-MAP Co., Ltd.
For inquiries about this press release or product information:
contact: pres.office@umap-corp.com